| Memory Type | DDR4 |
| Memory Form Factor | DIMM |
| The volume of one memory module | 8 GB |
| Register memory | No |
| Clock frequency | 3200 MHz |
| Type | operative memory |
| Model | Hiksemi |
| Manufacturer code | HSC408U32Z1-8G |
| Country of origin | china |
| Supply voltage | 1.2 V |
| Total memory capacity of the entire set | 8 GB |
| Number of modules included | 1 |
| ECC memory | No |
| Rank | peer |
| CAS Latency (CL) | 22 |
| RAS to CAS Delay (tRCD) | 22 |
| Row Precharge Delay (tRP) | 22 |
| The presence of a radiator | No |
| Illumination of board elements | No |
| Height | 31.25 mm |
| Low Profile | No |
| Activate to precharge delay (tRAS) | 52 |
| Intel XMP Profiles | No |
| Memory Type | DDR4 |
| Memory Form Factor | DIMM |
| The volume of one memory module | 8 GB |
| Register memory | No |
| Clock frequency | 3200 MHz |
| Type | operative memory |
| Model | Hiksemi |
| Manufacturer code | HSC408U32Z1-8G |
| Country of origin | china |
| Supply voltage | 1.2 V |
| Total memory capacity of the entire set | 8 GB |
| Number of modules included | 1 |
| ECC memory | No |
| Rank | peer |
| CAS Latency (CL) | 22 |
| RAS to CAS Delay (tRCD) | 22 |
| Row Precharge Delay (tRP) | 22 |
| The presence of a radiator | No |
| Illumination of board elements | No |
| Height | 31.25 mm |
| Low Profile | No |
| Activate to precharge delay (tRAS) | 52 |
| Intel XMP Profiles | No |
